Simulation of The Temperature Profile of The Curing Process of Thick Carbon Fiber Laminates Using The Age Algorithm

Amna Amna; Ahmad Kamal bin Zulkifle; Norma Alias; Norhalena Mohd. Nor; Noreliza Abu Mansor; Ishak Hashim

doi:10.51903/elkom.v13i1.11

Amna Amna Universitas Gajah Putih Indonesia
Ahmad Kamal bin Zulkifle Universiti Tenaga Nasional, Malaysia
Norma Alias Universiti Teknologi Malaysia
Norhalena Mohd. Nor Universiti Tenaga Nasional, Malaysia
Noreliza Abu Mansor Universiti Tenaga Nasional, Malaysia
Ishak Hashim

DOI: https://doi.org/10.51903/elkom.v13i1.11

Keywords: programming, problems, material, system

Abstract

This paper determines by simulation the temperature profiles of a thick carbon fiber/epoxy laminate during its cure process. The one-dimensional model of heat transfer is solved by using a finite difference numerical scheme. In the process, the same physical and thermal properties of materials used by ZhanSheng et al. are employed. The temperature is calculated through a judicious formulation and application of the Alternating Group Explicit (AGE) iterative method developed by Evans and Sahimi. A fourthorder Runge Kutta method is applied for the cure. The AGE scheme proves to be a viable iterative method with respect to stability, efficiency and rate of convergence.

References

C. Chepa Steven and Raymond P. Canale, Numerical Methods for Engineers with software and programming applications, 4th Ed., Mc Graw hill Boston, 2002. p.681-725.

D.C. Blest, B.R. Duffy, S. McKee and A.K. Zulkifle, “Curing Simulation of Thermoset Composites”, Journal: Composites: Part A ,1999, p. 1289- 1309.

D.C.Blest, S. McKee, A.K. Zulkifle and P. Marshall, “Curing simulation by autoclave resin infusion”, Journal: Composites Science and Techno logy 59(1999), p. 2297-2313

D.J. Evans and Sahimi, M.S., “The alternating group explicit iterative method (AGE) to solve parabolic and hyperbolic partial differential equations”, in Tien,C.L. and Chawla, T.C. (Ed.), Annual Review of Numerical Fluid Mechanics and Heat Transfer, United States of America , 2(1989), p. 283-389 .

Zhan-Sheng Guo, Shanyi Du and Boming Zhang, “Temperature field of thick thermoset composite laminates during cure process”, Journal: Composite Science and Technology 65 (2005), p.517-523.